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Technical
Product Bulletins |
MSDS |
Purchase |
E40-401
An excellent choice for electronic circuitry and components
that must be protected from moisture vapor transmission
and thermal shock resistance. |
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E40-403
A potting and casting resin that is reinforced with fiberglass
for large unit encapsulation. Low thermal coefficient of
expansion |
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E40-405
Low weight epoxy casting and potting resin. Low-density
syntactic foam, high bond strength to most substrates. Good
impact and thermal shock properties.
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E40-406
A rigid epoxy encapsulant designed for ease in handling
and exhibits excellent physical, thermal and electrical
insulation properties.
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E40-407
100% reactive resin, which does not contain any solvent,
diluents, plasticizers or additives that downgrade properties.
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E40-408
Designed for potting, casting, and encapsulating. Low shrinkage,
high tensile with temperature service from –50 to
180°C.
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E40-409
Combines ease in handling, excellent electrical properties
with choice room temperature and heat cure catalysts. Work
horse system for all purpose potting and encapsulating.
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E40-412
Thermally Conductive Epoxy Casting, Potting And Adhesive
Resin System
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E40-413
1:1 Ratio, Fire Retardant and Room Temperature Curing Epoxy
Resin System For Potting, Casting, And Encapsulation
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E40-414
Highest Heat Resistant, Aluminum Filled, Epoxy Casting Resin |
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E40-415
Flexible, 38 Shore D Hardness, Two-Component Epoxy Potting
Compound and Adhesive |
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E40-416
Thixotropic, Two-Component Epoxy Structural Adhesive Potting
Compound |
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E40-417
Low Cost, General-Purpose, Two-Component Epoxy, Casting
and Potting Compound |
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S103
Two-component silicone, high temperature
Potting compound |
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S104
Two-component silicone elastomer |
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S105
A two-component closed cell designed for potting,
Encapsulation and molding parts. 10 lb to 11 lb/ft3 density |
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U104
For potting, encapsulating, thermal insulation, flotation
And molding parts. 3lb/ft3 density |
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U105
A two-component closed cell designed for potting,
Encapsulation and molding parts. 10 lb to 11 lb/ft3 density |
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U106
Stress and minimal shrinkage during polymerization.
Excellent for electronic modules, coils, etc. |
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U107
Coils, and micro-electronic networks that require thermal
Cycling extremes and low pressure on delicate components. |
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Conductives
